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Advance Encapsulation

This technique employs a very sophisticated tooling mechanism. It is used when the total over-molded area of multiple electrical circuits need to be sealed from the elements and the cost of utilizing the previously described pre-mold over-mold concept is too prohibitive.

How It Works:

The basis behind this design offers "In mold" perfing of the stamping to define each circuit as previously described.

The over-molding process which utilizes a sophisticated mechanism incorporating timed core pulls offers total encapsulation of the stamping(s) without any identifying signs that perfing has taken place.The main advantage of this method is the resultant lower piece part cost compared with a part that has to be pre-molded, blanked and then over-molded.

The disadvantage of this method is the higher cost and longer lead-time it takes to design and build the tooling and the core pulling mechanism together with the extra cost of a specialized molding press.This method is therefore better suited for high volume applications where the cost of tooling can be amortized effectively.

Application

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